Products/Materials

 Products

  • Multi-layers up to 10 layers
  • Flex & Rigid-Flex
  • Blind / Buried via
  • High Performance Dielectric Technologies
  • Mixed Dielectric / Hybrid constructions
  • Controlled Impedance
  • Plasma Desmear / Etchback
  • Conductive & Non-conductive via fill
  • Carbon Paste
  • Selective Gold
  • Coloured Soldermask & Silkscreen
  • CTI Job Tracking Software

 Materials

  •  Standard Materials

     
    • IS-402 (Tg 130 -140º C) –In stock.
    • FR-406 High-TG (Tg 170) –In stock
    • Polyimide (Tg 260 º C) –Selected stock.
    • BT Epoxy (G200) –Selected stock.
  •  High Frequency Materials

     
    • IS-408HR ( Tg 200 C )
    • IS-408 (Tg 180º C) –High Tg with low Dk (3.8) –Selected stock.
    • Nelco 4000-13 –High Tg with low Dk (3.8) –Special order.
    • Rogers 3000, 4000, 5000 & 6000 series. –Selected stock for 4000 & rest special order.
    • Arlon 25 series-Special stock for Redline
    • PTFE/ Teflon –Special order.
    • Taconic –Special order.
  •  Lead Free Materials

     
    • PCL 370HR (Tg 180º C)
    • IS-410 (Tg 180º C)
    • IS-410, Matsushita MEM 1755 and Nelco 4000-13 (High Tg) laminates.
    • These materials are phenolic based with high decomposition (Td) temperature.
    • Processes like regular FR-4 type materials
    • Better z-axis properties and low water absorption at higher temperatures gives better stability during high temperature lead free assembly.
 
 
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